Instruments
Multifunctional Microscopy Unit
- Multiphoton microscopy (two-photon/advanced confocal) for deep three-dimensional imaging of 3D neural models
- Super-resolution microscopy (STED) for subcellular analysis of neuronal and synaptic structures
- Advanced electron microscopy platforms (SEM; TEM; FIB-SEM) for ultrastructural characterization of bioengineered tissues
Organ on Chip
- Customized organ-on-chip microfluidic platforms for modeling the brain microenvironment
- Microfabrication systems for microfluidic chips; including micromilling; soft lithography and 3D printing
- MEA systems for in vitro electrophysiological recordings from 3D neural networks integrated into organ-on-chip models
Procedures
- Characterization of optical and optoelectronic devices with the aid of open-source/open-hardware infrastructures that allow the implementation of complex optoelectronic measurements in both the visible and infrared ranges
- Two-photon polymerization (2PP) on the non-planar surface of a tapered optical fiber using a near-infrared laser
- Confocal and multiphoton imaging to characterize the properties of tapered optical fibers for optogenetics and fiber photometry, allowing the measurement of both the emission and collection light fields
- Multiphoton characterization of the optical properties of biological tissues
- Raman and hyperspectral imaging of organic and inorganic samples
- Fiber Raman microscopy
- Fiber holography for endoscopic Raman measurements
- Super-resolution imaging based on STED microscopy
- High-sensitivity UV-VIS-NIR spectrophotometry
- High-resolution atomic force microscopy integrated with an inverted line microscope (AFM)
- Fabrication of optical fibers and small-diameter fused silica capillaries
- Processing and characterization of materials through deposition processes on substrates and devices: thermal depositions of metals, AlN depositions via piezoelectric sputtering, and conformal Parylene coatings for complex 3D devices and MEMS
- Front-end techniques for the nanofabbrication and microfabbrication of passive and active semiconductor- and polymer-based piezoelectric microelectromechanical systems (MEMS) for energy harvesting and biosensing
- Back-end technologies useful for the second phase of MEMS and device microfabbrication: encapsulation of the individual chip within the chip carrier and the relative wiring for chip-to-package connections
- Dual-beam FIB/SEM system: including automated slice-and-view FIB tomography, electron and ion beam lithography, nanomanipulation, in situ probing, EDS, EBSD, and a range of imaging modalities. Deposition of Pt, Au, SiOx, and etching (XeF2)
- 3D printer systems
- Detailed electrochemical and spectroelectrochemical characterization of semiconductor thin films and electrochemical devices using tools for identifying critical performance parameters of photovoltaic devices
- Contact mechanics, lubrication, and theoretical tribology; experimental tribology (adhesion, friction, lubrication, wear, optical and electrical characterization of contact pairs); rheometry and spectroscopy; functionalization and chemical/physical characterization of surfaces
- Synthesis and characterization of engineered nanomaterials for biological applications
- Synthesis of organic molecules used as surface coatings, binders, and labels, conjugation of biomolecules, in vitro testing of materials on mammalian cell cultures and bacteria
- High-end data processing with high computing power and fast algorithms requiring high CPU and memory utilization